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 MOTOROLA SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc.
Order this document by DSP56156/D REV 1
Advance Information
DSP56156 DSP56156ROM
16-bit Digital Signal Processor
The DSP56156 is a general-purpose MPU-style Digital Signal Processor (DSP). On a single semiconductor chip, the DSP56156 comprises a very efficient 16-bit digital signal processing core, program and data memories, a number of peripherals, and system support circuitry. Unique features of the DSP56156 include a built-in sigma-delta (y) codec and phase-locked loop (PLL). This combination of features makes the DSP56156 a cost-effective, high-performance solution for many DSP applications, especially speech coding, digital communications, and cellular base stations. The central processing unit of the DSP56156 is the DSP56100 core processor. Like all DSP56100based DSPs, the DSP56156 consists of three execution units operating in parallel, allowing up to six operations to be performed during each instruction cycle. This parallelism greatly increases the effective processing speed of the DSP56156. The MPU-style programming model and instruction set allow straightforward generation of efficient, compact code. The basic architectures and development tools of Motorola's 16-bit, 24-bit, and 32-bit DSPs are so similar that understanding how to design and program one greatly reduces the time needed to learn the others. On-Chip Emulation (OnCETM port) circuitry provides convenient and inexpensive debug facilities normally available only through expensive external hardware. Development costs are reduced and in-field testing is greatly simplified using the OnCETM port. Figure 1 illustrates the DSP56156 in detail.
16-bit Bus 7 SigmaDelta Codec 2 16-bit Timer/ Event Counter 5 Sync. Serial (SSI) or I/O 5 Sync. Serial (SSI) or I/O 15 Host Interface (HI) or I/O Program Memory * 2048 x 16 RAM 64 x 16 ROM
(boot)
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Data Memory 2048 x 16 RAM
16-bit 56100 DSP Core
Internal Data Bus Switch OnCETM Port Clock PLL Gen. 3
Interrupt Control
Address Generation Unit
PAB XAB1 XAB2 GDB PDB XDB
External Address Bus Switch External Data Bus Switch
Address 16
Data 16
Program Decode Controller
Program Address Generator
Program Control Unit 4 IRQ 2
Data ALU 16 x 16 + 40 --> 40-bit MAC Two 40-bit Accumulators
Bus Control
Control 9
* 12 k x 16 ROM replaces the program RAM on the DSP56156ROM
Figure 1 DSP56156 Block Diagram
Specifications and information herein are subject to change without notice. OnCE is a trademark of Motorola, Inc.
(c) MOTOROLA INC., 1994
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Introduction DSP56156 Features
DSP56156 Features
Digital Signal Processing Core
* Efficient, object code compatible, 16-bit 56100-Family DSP engine -- -- -- -- -- -- -- -- -- -- -- -- -- Up to 30 Million Instructions Per Second (MIPS) - 33 ns instruction cycle at 60 MHz Up to 180 Million Operations Per Second (MOPS) at 60 MHz Highly parallel instruction set with unique DSP addressing modes Two 40-bit accumulators including extension byte Parallel 16 x 16-bit multiply-accumulate in 1 instruction cycle (2 clock cycles) Double precision 32 x 32-bit multiply with 72-bit result in 6 instruction cycles Least Mean Square (LMS) adaptive loop filter in 2 instructions 40-bit Addition/Subtraction in 1 instruction cycle Fractional and integer arithmetic with support for multiprecision arithmetic Hardware support for block-floating point FFT Hardware-nested DO loops including infinite loops Zero-overhead fast interrupts (2 instruction cycles) Three 16-bit internal data buses and three 16-bit internal address buses for maximum information transfer on-chip
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Memory
* On-chip Harvard architecture permitting simultaneous accesses to program and memories * 2048 x 16-bit on-chip program RAM and 64 x 16-bit bootstrap ROM (or 12 k x 16-bit on-chip program ROM on the DSP56156ROM) * 2048 x 16-bit on-chip data RAM * External memory expansion with 16-bit address and data buses * Bootstrap loading from external data bus, Host Interface, or Synchronous Serial Interface
Peripheral and Support Circuits
* Byte-wide Host Interface (HI) with Direct Memory Access support * Two Synchronous Serial Interfaces (SSI) to communicate with codecs and synchronous serial devices -- Built in -law and A-law compression/expansion -- Up to 32 software-selectable time slots in network mode * 16-bit Timer/Event Counter also generates and measures digital waveforms * On-chip sigma-delta voice band Codec: -- -- -- --
2
Sampling clock rates between 100 kHz and 3 MHz Four software-programmable decimation/interpolation ratios Internal voltage reference ( 2/5 of positive power supply) No external components required
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Introduction DSP56156 Features Documentation
* On-chip peripheral registers memory mapped in data memory space * Double buffered peripherals * Up to 27 general purpose I/O pins * Two external interrupt request pins * On-Chip Emulation (OnCETM) port for unobtrusive, processor speed-independent debugging * Software-programmable, Phase-Locked Loop-based (PLL) frequency synthesizer for the core clock
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Miscellaneous Features
* Power-saving Wait and Stop modes * Fully static, HCMOS design for operating frequencies from 40 or 60 MHz down to DC * 112-pin Ceramic Quad Flat Pack (CQFP) surface-mount package; 20 x 20 x 3 mm * 112-pin Plastic Thin Quad Flat Pack (TQFP) surface-mount package; 20 x 20 x 1.5 mm * 5 V power supply
Product Documentation
This data sheet plus the two manuals listed in Table 1 are required for a complete DSP56156 description and are necessary to properly design with the part. Documentation is available from a local Motorola distributor, a semiconductor sales office, or through a Motorola Literature Distribution Center.
Table 1 DSP56156 Documentation
Topic DSP56100 Family Manual Description Detailed description of the 56000family architecture and the 16-bit core processor and instruction set Detailed description of memory, peripherals, and interfaces Pin and package descriptions, and electrical and timing specifications Order Number DSP56100FAMUM/AD
DSP56156 User's Manual DSP56156 Data Sheet
DSP56156UM/AD DSP56156/D
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Introduction Documentation Data Sheet Contents
Related Documentation
Table 2 lists additional documentation relevant to the DSP56156.
Table 2 Related Motorola Documentation
Topic DSP Family Brochure Description Overview of all DSP product families Product Brief. Includes ordering information Application Report. Includes code Application Report. Comprehensive FFT algorithms and code for DSP56001, DSP56156, and DSP96002 Application Report. Theory and code using SB-ADPCM Flyer. Motorola's electronic bulletin board where free DSP software is available Brochures from companies selling hardware and software that supports Motorola DSPs Flyer. Motorola's program that supports universities in DSP research and education Order Number BR1105/D DSPTOOLSP/D APR3/D APR4/D
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Development Tools Fractional and Integer Arithmetic Fast Fourier Transforms (FFTs)
G.722 Audio Processing Dr. BuB Bulletin Board
APR404/D BR297/D
Third Party Compendium
DSP3RDPTYPAK/D
University Support Program
BR382/D
Data Sheet Contents
This data sheet contains: * * * * * signal definitions and pin locations electrical specifications and timings package descriptions design considerations ordering information
4
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Freescale Semiconductor, Inc.
Introduction Pin Groupings
Pin Groupings
The DSP56156 is available in a 112-pin Ceramic Quad Flat Pack (CQFP) and a 112-pin Plastic Thin Quad Flat Pack (TQFP). The input and output signals are organized into the functional groups indicated in Table 3. Figure 2 illustrates the chip's pin functions.
Table 3 Functional Pin Groupings
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Functional Group Address Data Bus Bus Control Host Interface (HI) Synchronous Serial Interfaces (SSI) Timer Interface Interrupt and Mode Control Phase-Locked Loop (PLL) and Clock On-Chip Emulation (OnCETM Port) On-Chip Codec Power (VCC) Ground (GND) Total
Number of Pins 16 16 9 15 10 2 4 3 4 7 10 16 112
NOTE:
OVERBARS are used throughout this document to indicate a signal which is at Ground voltage (typically a TTL logic low -- VIL or VOL) when the function is logically true. These signals are, likewise, at VCC voltage (typically a TTL logic high -- VIH or VOH) when the function is logically false.
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Introduction Pin Functions
DSP56156
A0-A15 D0-D15 RD WR BR BG BS TA PS/DS R/W BB Host Interface (HI) External Bus H0-H7* HA0-HA2* HR/W* HEN* HREQ* HACK*
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MODA/IRQA MODB/IRQB MODC RESET
Interrupt/ Mode Control
Two Synchronous Serial Interfaces (SSI)
STD0* SRD0* SCK0* SC00-SC10* STD1* SRD1* SCK1* SC01-SC11*
DSO DSI/OS0 DSCK/OS1 DR
On-Chip Emulator (OnCETM) Port
Timer/Event Counter
TIN* TOUT*
MIC AUX SPKP SPKM BIAS VREF VDIV
Clock and Phase-locked Loop (PLL) On-Chip Codec
EXTAL CLKO SXFC
112 pins
VCC GND
* These pins have an alternate function of general purpose input/output.
Figure 2 DSP56156 Pin Functions
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Pin Descriptions Address and Data Bus Bus Control
Pin Descriptions
Address and Data Bus
A0-A15 (Address Bus) -- three-state, active high outputs. A0-A15 change in t0 and specify the address for external program and data memory accesses. If there is no external bus activity, A0-A15 remain at their previous values. A0-A15 are three-stated during hardware reset. (Data Bus) -- three-state, active high, bidirectional input/outputs. Read data is sampled on the trailing edge of t2, while write data output is enabled by the leading edge of t2 and three-stated at the leading edge of t0. If there is no external bus activity, D0-D15 are three-stated. D0-D15 are also threestated during hardware reset.
(t0, t1, t2, t3), R/W goes high in t0. R/W is three-stated during hardware reset. WR (Write Enable) -- three-state, active low output. This output is asserted during external memory write cycles. When WR is asserted in t1, the data bus pins D0-D15 become outputs and the DSP puts data on the bus during the leading edge of t2. When WR is deasserted in t3, the external data has been latched inside the external device. When WR is asserted, it qualifies the A0-A15 and PS/DS pins. WR can be connected directly to the WE pin of a static RAM. WR is threestated during hardware reset or when the DSP is not bus master. RD (Read Enable) -- three-state, active low output. This output is asserted during external memory read cycles. When RD is asserted in late t0/early t1, the data bus pins D0-D15 become inputs and an external device is enabled onto the data bus. When RD is deasserted in t3, the external data is latched inside the DSP. When RD is asserted, it qualifies the A0-A15 and PS/DS pins. RD can be connected directly to the OE pin of a static RAM or ROM. RD is three-stated during hardware reset or when the DSP is not bus master. BS (Bus Strobe) -- three-state, active low output. Asserted at the start of a bus cycle (during t0) and deasserted at the end of the bus cycle (during t2). This pin provides an "early bus start" signal which can be used as address latch and as an "early bus end" signal which can be used by an external bus controller. BS is three-stated during hardware reset.
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D0-D15
Bus Control
PS/DS (Program/Data Memory Select) -- three-state, active low output. This output is asserted only when external data memory is referenced. PS/DS timing is the same for the A0-A15 address lines. PS/DS is high for program memory access and is low for data memory access. If the external bus is not used during an instruction cycle (t0, t1, t2, t3), PS/DS goes high in t0. PS/DS is in the high impedance state during hardware reset. R/W (Read/Write) -- three-state, active low output. Timing is the same as the address lines, providing an "early write" signal. R/W (which changes in t0) is high for a read access and is low for a write access. If the external bus is not used during an instruction cycle
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Pin Descriptions Bus Control
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TA (Transfer Acknowledge) -- active low input. If there is no external bus activity, the TA input is ignored by the DSP. When there is external bus cycle activity, TA can be used to insert wait states in the external bus cycle. TA is sampled on the leading edge of the clock. Any number of wait states from 1 to infinity may be inserted by using TA. If TA is sampled high on the leading edge of the clock beginning the bus cycle, the bus cycle will end 2T after the TA has been sampled low on a leading edge of the clock; if the Bus Control Register (BCR) value does not program more wait states. The number of wait states is determined by the TA input or by the Bus Control Register (BCR), whichever is longer. TA is still sampled during the leading edge of the clock when wait states are controlled by the BCR value. In that case, TA will have to be sampled low during the leading edge of the last period of the bus cycle programmed by the BCR (2T before the end of the bus cycle programmed by the BCR) in order not to add any wait states. TA should always be deasserted during
t3 to be sampled high by the leading edge of T0. If TA is sampled low (asserted) at the leading edge of the t0 beginning the bus cycle, and if no wait states are specified in the BCR register, zero wait states will be inserted in the external bus cycle, regardless the status of TA during the leading edge of T2.
BR (Bus Request) -- active low output when in master mode, active low input when in slave mode. After poweron reset, this pin is an input (slave mode). In this mode, the bus request BR allows another device such as a processor or DMA controller to become the master of the DSP external data bus D0-D15 and external address bus A0-A15. The DSP asserts BG a few T states after the BR input is asserted. The DSP bus controller releases control of the external data bus D0-D15, address bus A0-A15 and bus control pins PS/DS, RD, WR, and R/W at the earliest time possible consistent with proper synchronization. These pins are then placed in the high impedance state and
T0 T1 T2 T3 T0 T1 T2 Tw T2 T3 T0 T1 T2 T3 T0 T1 T2 Tw T2 Tw T2 T3 CLKO
TA BS T0 T1 T2 Tw T2 Tw T2 Tw T2 T3 T0 T1 T2 Tw T2 Tw T2 T3 T0 T1 T2 CLKO
TA BS
Figure 3 TA Controlled Accesses
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Pin Descriptions Bus Control
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the BB pin is deasserted. The DSP continues executing instructions only if internal program and data memory resources are accessed. If the DSP requests the external bus while BR input pin is asserted, the DSP bus controller inserts wait states until the external bus becomes available (BR and BB deasserted). Note that interrupts are not serviced when a DSP instruction is waiting for the bus controller. Note also that BR is prevented from interrupting the execution of a read/ modify/write instruction. If the master bit in the OMR register is set, this pin becomes an output (Master Mode). In this mode, the DSP is not the external bus master and has to assert BR to request the bus mastership. The DSP bus controller will insert wait states until BG input is asserted and will then begin normal bus accesses after the rising of the clock which sampled BB high. The BR output signal will remain asserted until the DSP no longer needs the bus. In this mode, the Request Hold bit (RH) of the Bus Control Register (BCR) allows BR to be asserted under software control. During external accesses caused by an instruction executed out of external program memory, BR remains asserted low for consecutive external X memory accesses and continues toggling for consecutive external P memory accesses unless the Request Hold bit (RH) is set inside the Bus Control Register (BCR). In the master mode, BR can also be used for non arbitration purpose: if BG is always asserted, BR is asserted in t0 of every external bus access. It can then be used as a chip select to turn a exter-
nal memory device off and on between internal and external bus accesses. BR timing is in that case similar to A0-A15, R/W and PS/DS; it is asserted and deasserted during t0. BG (Bus Grant) -- active low input when in master mode, active low output when in slave mode. Output after power on reset if the slave is selected, this pin is asserted to acknowledge an external bus request. It indicates that the DSP will release control of the external address bus A0-A15, data bus D0-D15 and bus control pins when BB is deasserted. The BG output is asserted in response to a BR input. When the BG output is asserted and BB is deasserted, the external address bus A0-A15, data bus D0-D15 and bus control pins are in the high impedance state. BG assertion may occur in the middle of an instruction which requires more than one external bus cycle for execution. Note that BG assertion will not occur during indivisible read-modify-write instructions (BFSET, BFCLR, BFCHG). When BR is deasserted, the BG output is deasserted and the DSP regains control of the external address bus, data bus, and bus control pins when the BB pin is sampled high. This pin becomes an input if the master bit in the OMR register is set (Master Mode). It is asserted by an external processor when the DSP may become the bus master. The DSP can start normal external memory access after the BB pin has been deasserted by the previous bus master. When BG is deasserted, the DSP will release the bus as soon as the current transfer is completed. The state of BG may be tested by testing the BS bit in the Bus Control Register. BG is ignored during hardware reset. 9
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Pin Descriptions Bus Control Interrupt and Mode Control
BB (Bus Busy) -- active low input when not bus master, active low output when bus master. This pin is asserted by the DSP when it becomes the bus master and it performs an external access. It is deasserted when the DSP releases bus mastership. BB becomes an input when the DSP is no longer the bus master.
MODB/IRQB (Mode Select B/External Interrupt Request B) -- input. This input has two functions: * to select the initial chip operating mode and, * to allow an external device to request a DSP interrupt after internal synchronization. MODB is read and internally latched in the DSP when the processor exits the reset state. MODA and MODB select the initial chip operating mode. Several clock cycles after leaving the reset state, the MODB pin changes to the external interrupt request IRQB. After reset, the chip operating mode can be changed by software. The IRQB input is an external interrupt request which indicates that an external device is requesting service. It may be programmed to be level sensitive or negative edge triggered. If level sensitive triggering is selected, an external pull up resistor is required for wiredOR operation. MODC (Mode Select C) -- input. This input selects the initial bus operating mode. When tied high, the external bus is programmed in the master mode (BR output and BG input) and when tied low the bus is programmed in the slave mode (BR input and BG output). MODC is read and internally latched in the DSP when the processor exits the reset state. After RESET, the bus operating mode can be changed by software by writing the MC bit of the OMR register. RESET (Reset) -- input. This input is a direct hardware reset of the processor. When RESET is asserted, the DSP is initialized and placed in the reset state. A Schmitt
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Interrupt and Mode Control
MODA/IRQA (Mode Select A/External Interrupt Request A) -- input. This input has two functions: * to select the initial chip operating mode and, * to allow an external device to request a DSP interrupt after internal synchronization. MODA is read and internally latched in the DSP when the processor exits the reset state. MODA and MODB select the initial chip operating mode. Several clock cycles after leaving the reset state, the MODA pin changes to the external interrupt request IRQA. The chip operating mode can be changed by software after reset. The IRQA input is a synchronized external interrupt request which indicates that an external device is requesting service. It may be programmed to be level sensitive or negative edge triggered. If level sensitive triggering is selected, an external pull up resistor is required for wired-OR operation. If the processor is in the stop standby state and IRQA is asserted, the processor will exit the stop state.
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Pin Descriptions Interrupt and Mode Control Host Interface
trigger input is used for noise immunity. When the reset pin is deasserted, the initial chip operating mode is latched from the MODA and MODB pins, and the initial bus operating mode is latched from the MODC pin. The internal reset signal should be deasserted synchronized with the internal clocks.
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Host Interface
H0-H7 (Host Data Bus) -- bidirectional. This bidirectional data bus is used to transfer data between the host processor and the DSP. This bus is an input unless enabled by a host processor read. H0-H7 may be programmed as Port B general purpose parallel I/O pins called PB0-PB7 when the Host Interface (HI) is not being used. HA0-HA2 (Host Address 0-2) -- input*. These inputs provide the address selection for each HI register and are stable when HEN is asserted. HA0-HA2 may be programmed as Port B general purpose parallel I/O pins called PB8-PB10 when the HI is not being used. HR/W (Host Read/Write) -- input*. This input selects the direction of data transfer for each host processor access. If HR/W is high and HEN is asserted, H0-H7 are outputs and DSP data is transferred to the host processor. If HR/W is low and HEN is asserted, H0-H7 are inputs and host data is transferred to the DSP. When HEN is asserted, HR/W is stable. HR/W may be programmed as a general purpose I/O pin called PB11 when the HI is not being used.
HEN (Host Enable) -- input*. This input enables a data transfer on the host data bus. When HEN is asserted and HR/W is high, H0-H7 becomes an output and DSP data may be latched by the host processor. When HEN is asserted and HR/W is low, H0-H7 is an input and host data is latched inside the DSP when HEN is deasserted. Normally a chip select signal derived from host address decoding and an enable clock is connected to the Host Enable. HEN may be programmed as a general purpose I/O pin called PB12 when the HI is not being used. HREQ (Host Request) -- output*. This opendrain output signal is used by the HI to request service from the host processor. HREQ may be connected to an interrupt request pin of a host processor, a transfer request of a DMA controller, or a control input of external circuitry. HREQ is asserted when an enabled request occurs in the HI. HREQ is deasserted when the enabled request is cleared or masked, DMA HACK is asserted, or the DSP is reset. HREQ may be programmed as a general purpose I/O pin (not open-drain) called PB13 when the HI is not being used. HACK (Host Acknowledge) -- input*. This input has two functions: * to provide a host acknowledge signal for DMA transfers and, * to control handshaking and to provide a host interrupt acknowledge compatible with MC68000 family processors. If programmed as a host acknowledge signal, HACK may be used as a data strobe for HI DMA data transfers. If programmed as an MC68000 host interrupt
* These pins can be bidirectional when programmed as general purpose I/O. MOTOROLA
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Pin Descriptions 16-bit Timer SSI
acknowledge, HACK enables the HI Interrupt Vector Register (IVR) onto the host data bus H0-H7 if the Host Request HREQ output is asserted. In this case, all other HI control pins are ignored and the HI state is not affected. HACK may be programmed as a general purpose I/O pin called PB14 when the HI is not being used.
PC0 and PC5, respectively, when the STD function is not being used. SRD0-1 (SSI0-1 Receive Data) -- input*. These input pins receive serial data and transfer the data to the SSI0-1 Receive Shift Register. SRD0 and SRD1 may be programmed as a general purpose I/O pin called PC1 and PC6, respectively, when the SRD function is not being used. SCK0-1 (SSI0-1 Serial Clock) -- bidirectional. These bidirectional pins provide the serial bit rate clock for the SSI0-1 interface. SCK0 and SCK1 may be programmed as a general purpose I/O pin called PC2 and PC7, respectively, when the SSI0-1 interfaces are not being used. SC10-11 (SSI0-1 Serial Control 1) -- bidirectional. These bidirectional pins are used by the SSI0-1 serial interface as frame sync I/O or flag I/O. SC10 and SC11 may be programmed as a general purpose I/O pin called PC3 and PC8, respectively, when the SSI0-1 are not using these pins. SC00-01 (SSI0-1 Serial Control 0) -- bidirectional. These bidirectional pins are used by the SSI0-1 serial interface as frame sync I/O or flag I/O. SC00 and SC01 may be programmed as a general purpose I/O pin called PC4 and PC9, respectively, when the SSI0-1 are not using these pins.
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16-bit Timer
TIN (Timer Input) -- input*. This input receives external pulses to be counted by the on-chip 16-bit timer when external clocking is selected. The pulses are internally synchronized to the DSP core internal clock. TIN may be programmed as a general purpose I/O pin called PC10 when the external event function is not being used. TOUT (Timer Output) -- output*. This output generates pulses or toggles on a timer overflow event or a compare event. TOUT may be programmed as a general purpose I/O pin called PC11 when disabled by the timer out enable bits (TO2-TO0).
Synchronous Serial Interfaces (SSI)
STD0-1 (SSI0-1 Transmit Data) -- output*. These output pins transmit serial data from the SSI0-1 Transmit Shift Register. STD0 and STD1 may be programmed as a general purpose I/O pin called
* These pins can be bidirectional when programmed as general purpose I/O.
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Pin Descriptions OnCE On-Chip Codec
On-Chip Emulation (OnCETM Port)
DSI/OS0 (Debug Serial Input/Chip Status 0) -- bidirectional. The DSI/OS0 pin, when an input, is the pin through which serial data or commands are provided to the OnCE port controller. The data received on the DSI pin will be recognized only when the DSP has entered the debug mode of operation. Data must have valid TTL logic levels before the serial clock falling edge. Data is always shifted into the OnCE serial port most significant bit (MSB) first. When the DSP is not in the debug mode, the DSI/ OS0 pin provides information about the chip status if it is an output and used in conjunction with the OS1 pin. DSCK/OS1 (Debug Serial Clock/Chip Status 1) -- bidirectional. The DSCK/OS1 pin, when an input, is the pin through which the serial clock is supplied to the OnCE port. The serial clock provides pulses required to shift data into and out of the OnCE serial port. Data is clocked into the OnCE port on the falling edge and is clocked out of the OnCE serial port on the rising edge. If the DSCK/OS1 pin is an output and used in conjunction with the OS0 pin, it provides information about the chip status when the DSP is not in the debug mode. DSO (Debug Serial) -- output. The debug serial output provides the data contained in one of the OnCE port controller registers as specified by the last command received from the command controller. When idle, this pin is high. When the requested data is available, the DSO line will be asserted (negative true logic) for four T cycles (one instruction
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cycle) to indicate that the serial shift register is ready to receive clocks in order to deliver the data. When the chip enters the debug mode due to an external debug request (DR), an internal software debug request (DEBUG), a hardware breakpoint occurrence or a trace/step occurrence, this line will be asserted for three T cycles to indicate that the chip has entered the debug mode and is waiting for commands. Data is always shifted out the OnCE serial port with the most significant bit first. DR (Debug Request) -- input. The debug request input provides a means of entering the debug mode of operation. This pin, when asserted, will cause the DSP to finish the current instruction being executed, enter the debug mode, and wait for commands to be entered from the debug serial input line.
On-Chip Codec
AUX (Auxiliary) -- input. This pin is selected as the analog input to the A/D converter when the INS bit is set in the codec control register COCR. This pin should be left floating when the codec is not used. BIAS (Bias current) -- input. This input is used to determine the bias current for the analog circuitry. Connecting a resistor between BIAS and GNDA will program the current bias generator. This pin should be left floating when the codec is not used. MIC (Microphone) -- input. This pin is selected as the analog input to the A/D converter when the INS bit is cleared in
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Pin Descriptions On-Chip Codec Power, Ground, and Clock
the codec control register COCR. This pin should be left floating when the codec is not used. SPKP (Speaker Plus) -- output. This pin is the positive analog output from the onchip D/A converter. This pin should be left floating when the codec is not used. SPKM (Speaker Minus) -- output. This pin is the negative analog output from the on-chip D/A converter. This pin should be left floating when the codec is not used. VREF (Voltage Reference) -- output. This pin is the op-amp buffer output in the reference voltage generator. It has a value of (2/5)VCCA. This pin should always be connected to the GNDA through two capacitors, even when the codec is not used. VDIV (Voltage Division) -- output. This output pin is also the output to the onchip op-amp buffer in the reference voltage generator. It is connected to a resistor divider network located within the codec block which provides a voltage equal to (2/5)VCCA. This pin should be connected to the GND via a capacitor when the codec is used and should be left floating when the codec is not used.
GNDS (Synthesizer Ground) -- This pin supplies a quiet ground source to the PLL to provide greater frequency stability. VCCA (Analog Power) -- This pin is the positive analog supply input. It should be connected to VCC when the codec is not used. GNDA (Analog Ground) -- This pin is the analog ground return. It should be connected to digital GND when the codec is not used. EXTAL (External Clock) -- input. This input should be driven by an external clock or by an external oscillator. After being squared, the input frequency can be used as the DSP core internal clock. In that case, it is divided by two to produce a four phase instruction cycle clock, the minimum instruction time being two input clock periods. This input frequency is also used, after division, as input clock for the on-chip codec and the onchip PLL. CLKO (Clock Output) -- output. This pin outputs a buffered clock signal. By programming two bits (CS1-CS0) inside the PLL Control Register (PLCR), the user can select between outputting a squared version of the signal applied to EXTAL, a squared version of the signal applied to EXTAL divided by 2, and a delayed version of the DSP core master clock. The clock frequency on this pin can be disabled by setting the Clockout Disable bit (CD; bit 7) of the Operating Mode Register (OMR). When disabled, the pin can be left floating. SXFC (External Filter Capacitor) -- This pin adds an external capacitor to the PLL filter circuit. A low leakage capacitor should be connected between and located very close to SXFC and VCCS.
Freescale Semiconductor, Inc...
Power, Ground, and Clock
VCC (Power) -- Power pins GND (Ground) -- Ground pins VCCS (Synthesizer Power) -- This pin supplies a quiet power source to the PhaseLocked Loop (PLL) to provide greater frequency stability.
14
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Electrical Characteristics and Timing
Electrical Characteristics and Timing
CAUTION:
Exceeding maximum electrical ratings will permanently damage or disable the chip, or impair the chip's long term reliability.
The DSP56156 is fabricated in high density HCMOS with TTL compatible inputs and CMOS compatible outputs.
Freescale Semiconductor, Inc...
Table 4 Maximum Electrical Ratings (GND = 0 Vdc)
Rating
Supply Voltage All Input Voltages Current Drain per Pin excluding VCC and GND Storage Temperature
Symbol
VCC VIN I Tstg
Value
-0.3 to +7.0 GND - 0.5 to VCC + 0.5 10 -55 to +150
Unit
V V mA
C
Table 5 Operating Conditions
Supply Voltage VCC
Min 4.5 Max 5.5
Junction Temperature TJ (C)
Min -40 Max 115
Table 6 Thermal Characteristics of CQFP and TQFP Packages
Thermal Resistance Characteristics
Junction to Ambient Junction to Case (estimated)
Value Symbol CQFP
JA JC 40 7
Rating TQFP
49 8
C/W C/W
NOTE: This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either GND or VCC).
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Freescale Semiconductor, Inc.
Electrical Characteristics and Timing Analog I/O Characteristics
Analog I/O Characteristics
(VCCA = 5.0 V dc 10%, TJ = -40 to +125C) The analog I/O characteristics of this device are listed in Table 7. For additional information regarding the use of analog signals, see "Design Considerations" at the end of this document.
Table 7 Analog I/O Characteristics
Freescale Semiconductor, Inc...
Characteristic
Input Impedance on MIC and AUX Input Capacitance on MIC and AUX Peak Input Voltage on the MIC/AUX Input for Full Scale Linearity (0.14 dBm0): 6 dB - MGS1 - 0 = 00 (See Note 2) 0 dB - MGS1 - 0 = 01 6 dB - MGS1 - 0 = 10 17 dB - MGS1 - 0 = 11 Internal Input Gain Variation; G = -6 dB, 0 dB, 6 dB or 17 dB (0.83 dB variation due to 10% variation on VCC): VREF Output Voltage VREF Output Current DC Offset Between SPKP and SPKM Allowable Differential Load Capacitance on SPKP and SPKM (with 1 k in series) Allowable Single-ended Load Capacitance on SPKP or SPKM (with 0.5 k in series) Maximum Single-ended Signal Output Level Maximum Differential Signal Output Level Single-ended Load Resistance Differential Load Resistance Resistance BIAS (See Note 1)
Min
46 -- -- -- -- -- G - 0.83
Typ
78 -- -- -- -- -- G
Max
1400 10 1.414 0.707 354 100 G + 0.83
Unit
k pF Vp Vp mVp mVp dB
1.8 -- -- 0 0 (See Note 3) -- -- 500 1 --
2 -- -- -- -- -- -- -- -- 10 (See Note 4) VC
2.2 1 100 0.05 100 0.1 1 2 -- -- --
V mA mV F F Vp Vp k k
Internal Output Volume Control Variation VC = -20, -15, -10, -5, 0, 6, 12, 18, 24, 30, 35 dB ( 0.83 dB variation due to 10% variation on V CC) NOTES: 1. 2. 3. 4.
VC - 0.83
VC + 0.83
dB
Minimum value reached for a Codec clock of 3 MHz, typical for 2 MHz and maximum for 100 kHz 0 dBm0 corresponds to 3.14 dB below the input saturation level AC coupling is necessary in single-ended mode when the load resistor is not tied to VREF 10%
16
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Electrical Characteristics and Timing A/D and D/A Performance
A/D and D/A Performance
(VCCA = 5.0 V dc 10%, TJ = -40 to +125C) The A/D and D/A performance of the codec section are given in Table 8 with an example presented in Figure 4. Table 8 A/D and D/A Performance of Codec
Freescale Semiconductor, Inc...
Characteristic
Analog to Digital Section Signal to Noise plus Distortion Ratio (S/N+T)
Level 0 dBm0
Min
55 15 55 15
Typ (See Note 1)
65 20 65 20
Max
-- -- -- --
Unit
dB dB dB dB
(See Note 2)
-50 dBm0
Digital to Analog Section Signal to Noise plus Distortion Ratio (S/N+T)
0 dB -50 dB
NOTES: 1. 0 dB gain on the A/D and D/A; Codec clock at 1.538 MHz with 128 decimation/interpolation ratio and tested at 1502 Hz 2. 0 dBm0 corresponds to -3.14 dB below the input saturation level
80 70
S/N S/N+T
13 MHz
2 MHz
/ 6.5
CODEC Codec
1 MHz
COCR=$E400
60 50 40 30 20 10 0
/ 13 /13
PLL PLL /(12+1)x4 /(12+1)*4
52 MHz
S in dB Signal in dB
Figure 4 Example: S/N and S/N+T Performance for the A/D Section
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Freescale Semiconductor, Inc.
Electrical Characteristics and Timing Other On-Chip Codec Characteristics
Other On-Chip Codec Characteristics
(VCCA = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) The analog I/O characteristics of this device are shown in Table 9.
Table 9 Analog I/O Characteristics of On-Chip Codec
Freescale Semiconductor, Inc...
Characteristic
Codec Master Clock Codec Sampling Rate A/D Section Group Delay D/A Section Group Delay
Min
0.1 78 -- --
Typ
2.048 16000 -- --
Max
3 37000 0.2 0.2
Unit
MHz Hz msec msec
18
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
DC Electrical Characteristics and Timing
DC Electrical Characteristics
(GND = 0 V dc) (VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) The DC electrical characteristics of this device are shown in Table 10.
Table 10 DC Electrical Characteristics
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Characteristic
Input High Voltage except EXTAL, RESET, MODA, MODB, MODC Input Low Voltage except EXTAL, MODA, MODB, MODC Input High Voltage EXTAL DC coupled EXTAL AC coupled (See Note 1) Input Low Voltage EXTAL DC coupled EXTAL AC coupled (See Note 1) Input High Voltage RESET Input High Voltage MODA, MODB, MODC Input Low Voltage MODA, MODB, MODC Input Leakage Current EXTAL RESET, MODA, MODB, MODC, TA, DR, BR Three-State (Off-State) Input Current (@2.4 V/0.5 V) Output High Voltage (IOH = -10 A) Output High Voltage (IOH = -0.4 mA) Output Low Voltage (IOL = 10 A) Output Low Voltage (IOL = 3.2 mA R/W IOL = 1.6 mA; Open Drain HREQ IOL = 6.7 mA, TXD IOL = 6.7 mA) Input Capacitance (See Note 2)
Symbol
VIH VIL VIHC
Min
2.0 -0.5
Typ
-- --
Max
VCC 0.8
Unit
V V V
70% of VCC 1 VILC -0.5 -0.5 VIHR VIHM VILM IIN -100 -1 TSI VOHC VOH VOLC VOL -10 VCC -0.1 2.4 -- -- 2.5 3.5 -0.5
-- -- -- -- -- -- -- --
VCC VCC V 20% of VCC VCC-1 VCC VCC 2.0 100 1 V V V A A A V V V V
-- -- -- -- --
10 -- -- 0.1 0.4
CIN
--
10
--
pF
NOTES:
1. When EXTAL is AC coupled, VIHC - VILC S 1 V must be true. 2. Input capacitance is periodically sampled and not 100% tested in production.
MOTOROLA
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Clock Operation Timing
AC Electrical Characteristics
(GND = 0 V dc) The timing waveforms in the AC Electrical Characteristics are tested with a VIL maximum of 0.5 V and a VIH minimum of 2.4 V for all pins, except EXTAL, RESET, MODA, MODB and MODC. These five pins are tested using the input levels set forth in the DC Electrical Characteristics. AC timing specifications which are referenced to a device input signal are measured in production with respect to the 50% point of the respective input signal's transition. The DSP56156 output levels are measured with the production test machine VOL and VOH reference levels set at 0.8 V and 2.0 V respectively.
Freescale Semiconductor, Inc...
Clock Operation Timing
The system clock to the DSP56156 must be externally supplied to EXTAL as illustrated in Figure 6. Table 11 Clock Operation Timing
40 MHz Num Characteristics Sym Min 1 2 3 4 5 6 7 Frequency of Operation (EXTAL) Instruction Cycle Time = 2TC Wait State Time = TC = 2T EXTAL Cycle Period EXTAL Rise Time (See Note 1) EXTAL Fall Time (See Note 1) EXTAL Width High 48-52% duty cycle (See Notes 2, 3, 4) EXTAL Width Low 48%-52% duty cycle (See Notes 2, 3, 4) TH f ICYC -- TC 0 50 25 25 -- -- 12 Max 40 x x x 4 4 x Min 0 40 20 20 -- -- 9.6 Max 50 x x x 3 3 x Min 0 33 16.6 16.6 -- -- 8 Max 60 x x x 3 3 x MHz ns ns ns ns ns ns 50 MHz 60 MHz Unit
8
TL
12
x
9.6
x
8
x
ns
NOTES: 1. Rise and fall time may be relaxed to 12 ns maximum if the EXTAL input frequency is less than or equal to 20 MHz. If the EXTAL input frequency is between 20 MHz and 40 MHz, rise and fall time should meet the specified values in the 40 MHz column (4 ns maximum). 2. The duty cycle may be relaxed to 43-57% if the EXTAL input frequency is less than or equal to 20 MHz. If the EXTAL input frequency is between 20 MHz and 40 MHz, the duty cycle should be such that TH and TL meet the specified values in the 40 MHz column (12 ns minimum). 3. T = ICYC / 4 is used in the electrical characteristics. The exact length of each T is affected by the duty cycle of the external clock input. 4. Duty cycles and EXTAL widths are measured at the EXTAL input signal midpoint when AC coupled and at VCC/2 when not AC coupled.
20
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Clock Operation Timing PLL
TH
EXTAL
TL
90% 10%
VIHC Midpoint VILC 5
7 4
8 6 2
Figure 5 External Clock Timing
Freescale Semiconductor, Inc...
Other Clock and PLL Operation Timing
Clock and PLL timings are listed in Table 12 and the clocking configurations are illustrated in Figure 6. Table 12 Clock and PLL Timing
Characteristics
PLL Output frequency EXTAL Input Clock Amplitude (See Note 2)
Min
10 1
Max
Max Fosc (See Note 1) VCC
Unit
MHz Vpp
NOTES: 1. Maximum DSP operating frequency. See Table 11. 2. An AC coupling capacitor is required on EXTAL if the levels are out of the normal CMOS level range (VILC>20% of VCC or VIHC<70% of VCC).
10 nF XFC
0.01 F 0.1 F
SXFC
/ 1 to / 16
VCCS VCO
/4
GNDS
PLLE=1
EXTAL
1000 pF
100 K
ED3-ED0
PFD
LF
/ 1 to / 16
YD3-YD0
Fosc
PLLE=0
PLL
GSM
/ 6.5
CS1-CS0
CODEC CLKO
/2
internal phase PH0 at Fosc
Figure 6 Clocking Configurations
MOTOROLA
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing
Reset, Stop, Wait, Mode Select, and Interrupt Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles ws = Number of wait states programmed into external bus access using BCR (WS = 0 - 31) Table 13 Reset, Stop, Wait, Mode Select, and Interrupt Timing
40 MHz Num Characteristics Min 10 11 RESET Assertion to Address, Data and Control Signals High Impedance Minimum Stabilization Duration (See Note 1) OMR bit 6=0 OMR bit 6=1 Asynchronous RESET Deassertion to First External Address Output (See Note 7) Synchronous Reset Setup Time from RESET Deassertion to Rising Edge of CLKO Synchronous Reset Delay Time from CLKO High to the First External Access (See Note 7) Mode Select Setup Time Mode Select Hold Time Edge-triggered Interrupt Request Width Delay from IRQA, IRQB Assertion to External Data Memory Access Out Valid - Caused by First Interrupt Instruction Fetch - Caused by First Interrupt Instruction Execution Delay from IRQA, IRQB Assertion to General Purpose Output Valid Caused by the Execution of the First Interrupt Instruction Delay from External Data Memory Address Output Valid Caused by First Interrupt Instruction Execution to Interrupt Request Deassertion for Level Sensitive Fast Interrupts (See Note 2)
--
50 MHz Min
--
60 MHz Unit Min
--
Freescale Semiconductor, Inc...
Max
25
Max
23
Max
21 ns
600KT 60T 16T
-- -- 18T+20
600KT 60T 16T
-- -- 18T+17
600KT 60T 16T
-- -- 18T+15
ns ns ns
12
13
7
cyc-4
6
cyc-3
5
cyc-2
ns
14
16T+3
16T+20
16T+ 3
16T+18
16T+3
16T+16
ns
15 16 17 18
22 0 13
-- -- --
20 0 11
-- -- --
18 0 9
-- -- --
ns ns ns
11T+4 19T+4
-- -- --
11T+4 19T+4
-- --
11T+3 19T+3
-- --
ns ns
19
22T+5
22T+4
--
22T+3
--
ns
20
--
5T-26 + cyc x ws
--
5T-24 + cyc x ws
--
5T-22 + cyc x ws
ns
22
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) Table 13 Reset, Stop, Wait, Mode Select, and Interrupt Timing (continued)
40 MHz Num Characteristics Min 21 Delay from General-Purpose Output Valid Caused by the Execution of the First Interrupt Instruction to IRQA, IRQB Deassertion for Level Sensitive Fast Interrupts -- If 2nd Interrupt Instruction is: Single Cycle (See Note 2) Two Cycles Synchronous setup time from IRQA, IRQB assertion to Synchronous falling edge of CLKO (See Notes 5 and 6) Falling Edge of CLKO to First Interrupt Vector Address Out Valid after Synchronous recovery from Wait State (See Notes 3 and 5) IRQA Width Assertion to Recover from Stop State (See Note 4) Delay from IRQA Assertion to Fetch of first instruction (exiting Stop) (See Notes 1 and 3) OMR bit 6=0 OMR bit 6=1 Duration for Level Sensitive IRQA Assertion to Cause the Fetch of First IRQA Interrupt Instruction (exiting Stop) (See Notes 1 and 3) OMR bit 6=0 OMR bit 6=1 Delay from Level Sensitive IRQA Assertion to First Interrupt Vector Address Out Valid (exiting Stop) (See Notes 1 and 3) OMR bit 6=0 OMR bit 6=1 Max Min Max Min Max 50 MHz 60 MHz Unit
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-- -- 14
cyc - 29 3 cyc - 29 cyc-3
-- -- 13
cyc - 27 3 cyc - 27 cyc-2
-- -- 12
cyc - 26 3 cyc - 26 cyc-1
ns ns ns
22
23
27T+3
27T+20
27T+3
27T+18
27T+3
27T+16
ns
24
15
--
13
--
12
--
ns
25
524303T+4 47T+4
-- --
524303T+3 47T+3
-- --
524303T+3 47T+3
-- --
ns ns
28
524303T 47T
-- --
524303T 47T
-- --
524303T 47T
-- --
ns ns
29
524303T+4 47T+4
-- --
524303T+3 47T+3
-- --
524303T+3 47T+3
-- --
ns ns
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing
NOTES:
1. Circuit stabilization delay is required during reset when using an external clock in two cases: * after power-on reset * when recovering from Stop mode 2. When using fast interrupts, IRQA or IRQB is defined as level-sensitive, then timings 20 and 21 apply to prevent multiple interrupt service. To avoid these timing restrictions, the negative edge-triggered mode is recommended when using fast interrupts. 3. The interrupt instruction fetch is visible on the pins only in Mode 3. 4. The minimum is specified for the duration of an edge triggered IRQA interrupt required to recover from the Stop state. This is not the minimum required so that the IRQA interrupt is accepted. 5. Timing #22 is for all IRQx interrupts while timing #23 is only when exiting the Wait state. 6. Timing #22 triggers off T1 in the normal state and off phi1 when exiting the Wait state. 7. The instruction fetch is visible on the pins only in Mode 2 and Mode 3.
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VIHR RESET
11 D0-D15 A0-A15 PS/DS R/W BS 10
12
First Fetch
Figure 7 Asynchronous Reset Timing
CLKO 13
RESET 14
A0-A15 PS/DS BS R/W
Figure 8 Synchronous Reset Timing
24
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing
VIHR RESET 15 16 MODA MODB MODC VIHM VILM VIH VIL IRQA IRQB
Freescale Semiconductor, Inc...
Figure 9 Operating Mode Select Timing
IRQA IRQB 17
Figure 10 External Interrupt Timing (Negative Edge-Triggered)
A0-A15 PS/DS BS R/W
First Interrupt Instruction Execution
IRQA IRQB
18
20
a) First Interrupt Instruction Execution
General Purpose I/O Pin
IRQA IRQB
19
21
b) General Purpose I/O
Figure 11 External Level-Sensitive Fast Interrupt Timing
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing
CLKO
T0, T2 phi0
T1, T3 phi1
22 IRQA IRQB
23
Freescale Semiconductor, Inc...
A0-A15 PD/DS BS R/W
First Interrupt Instruction Fetch
Figure 12 Synchronous Interrupt from Wait State Timing
24 IRQA
25 A0-A15 PD/DS BS R/W First Instruction Fetch Not IRQA Interrupt Vector
Figure 13 Recovery from Stop State Using Asynchronous Interrupt Timing
IRQA
28
A0-A15 PD/DS BS R/W
29 First IRQA Interrupt Instruction Fetch
Figure 14 Recovery from Stop State Using IRQA Interrupt Service
26
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing
Table 14 Wait and Stop Timings
40 MHz Num Characteristics Min 30 DR Asserted to CLK high (Setup Time for Synchronous Recovery from Wait State) CLK high to DSO (ACK) Valid (Enter Debug Mode) after Synchronous Recovery from Wait State DR to DSO (ACK) Valid (Enter Debug Mode) - After Asynchronous Recovery from Stop State - After Asynchronous Recovery from Wait State DR Assertion Width - to Recover from Wait/Stop without entering debug mode - to Recover from Wait/Stop short wake-up and enter debug mode - to Recover from Stop long wake-up and enter debug mode Max Min Max Min Max 50 MHz 60 MHz Unit
10
cyc - 4
9
cyc - 3
8
cyc - 2
ns
Freescale Semiconductor, Inc...
31
18 cyc
--
18 cyc
--
18 cyc
--
ns
32
29 cyc 18 cyc
-- --
29 cyc 18 cyc
-- --
29 cyc 18 cyc
-- --
ns ns
33
12 29 cyc 262157 cyc
10 cyc -- --
11 29 cyc 262157 cyc
10 cyc -- --
10 29 cyc 262157 cyc
10 cyc -- --
ns ns ns
33 DR (input)
32 DSO (output)
Figure 15 Recovery from Wait State Using DR Pin -- Synchronous Timing
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Reset, Stop, Wait, Mode Select, and Interrupt Timing Capacitance Derating
CLKO (output)
T0, T2
T1, T3
33 DR (input)
30
31
Freescale Semiconductor, Inc...
DSO (output)
Figure 16 Recovery from Wait/Stop State Using DR Pin -- Asynchronous Timing
Capacitance Derating
The DSP56156 External Bus Timing Specifications are designed and tested at the maximum capacitive load of 50 pF, including stray capacitance. Typically, the drive capability of the External Bus pins (A0-A15, D0-D15, PS/DS, RD, BS, WR, R/W) derates linearly at 1 ns per 12 pF of additional capacitance from 50 pF to 250 pF of loading. Port B and C pins derate linearly at 1 ns per 5 pF of additional capacitance from 50 pF to 250 pF of loading. When an internal memory access follows an external memory access, the PS/DS, R/W, RD and WR strobes remain deasserted and A0-A15 do not change from their previous state.
28
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing External Bus Synchronous Timing
External Bus Synchronous Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) Table 15 lists external bus synchronous timing. Figure 17 and illustrate the bus timings with no wait states and two wait states, respectively.
Table 15 External Bus Synchronous Timing
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40 MHz Num Characteristic Min 34 35 EXTAL CLK In High to CLKO High CLKO High to a. A0-A15 Valid b. PS/DS, R/W Valid, BS, RD Asserted 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 NOTE: BS Width Deasserted CLKO High to WR Asserted Low WR and RD Deasserted High to BS Asserted Low (2 Successive Bus Cycles) CLKO High to BS Deasserted TA Valid to CLKO High (Setup) CLKO High to TA Invalid (Hold) CLKO High to D0-D15 Out Valid CLKO High to D0-D15 Out Invalid D0-D15 In Valid to CLKO Low (Setup) CLKO Low to D0-D15 In Invalid (Hold) CLKO Low to WR, RD Deasserted WR, RD Hold Time from CLKO Low CLKO High to D0-D15 Three-state CLKO High to D0-D15 Out Active CLKO High to A0-A15, PS/DS, R/W Invalid 10 ns CL = 25 pF 2.6 4.5 0 1.7 2.0 6 0 -- 2.2 0 1.2 2.8 10.3 -- -- 7.1 -- -- -- 10 -- 6 4.2 -- 2.4 4.7 4.7 18.3 T+3.1 14.3 Max 9 12 14 -- T+12.4 15.8
50 MHz Min 2.4 4.7 4.7 13.4 T+3.1 11.8 Max 9 12 14 -- T+12.4 13.3 Min 2.4 4.7 4.7 9.8
60 MHz Unit Max 9 12 4 -- T+12.4 11.8 ns ns ns ns ns ns
(See Note)
T+3.1 10.2
2.6 4.5 0 1.7 2.0 6 0 -- 2.2 0 1.2 2.8
10.3 -- -- 7.1 -- -- -- 10 -- 6 4.2 --
2.6 4.5 0 1.7 2.0 6 0 -- 2.2 0 1.2 2.8
10.3 -- -- 7.1 -- -- -- 10 -- 6 4.2 --
ns ns ns ns ns ns ns ns ns ns ns ns
MOTOROLA
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing External Bus Synchronous Timing
T0 EXTAL (Input) CLKO (Output) 34 35
T1
T2
T3
T0
T1
T2
51
Freescale Semiconductor, Inc...
A0-A15 PS/DS R/W (See Note) 35 BS (Output) 37 WR (Output) 35 RD (Output) 47 48 42 TA (Input) 43 D0-D15 (Output) 50 45 D0-D15 (Input) Data In 46 Data Out 49 41 41 47 40 36
48
44
NOTE: During Read-Modify-Write instructions and internal instructions, the address lines do not change state.
Figure 17 External Bus Synchronous Timing -- No Wait States
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Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing External Bus Synchronous Timing
T0 EXTAL (Input) CLKO (Output) 34
T1
T2
Tw
T2
Tw
T2
T3
T0
35 A0-A15, PS/DS, R/W (Outputs) 35 BS (Output) 37 WR (Output) 47 48 35 RD (Output) 47 48 41 42 TA (Input) 42 40 36
51
Freescale Semiconductor, Inc...
41
44 43 D0-D15 (Output) 50 46 45 D0-D15 (Input) Data In Data Out 49
Figure 18 External Bus Synchronous Timing - Two Wait States
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
31
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing External Bus Asynchronous Timing
External Bus Asynchronous Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) cyc WS WT = Clock cycle = 1/2 instruction cycle = 2 T cycles = Number of Wait States, Determined by BCR Register (WS = 0 to 31) = WS x cyc = 2T x WS
Freescale Semiconductor, Inc...
32
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing External Bus Asynchronous Timing
A0-A15, PS/DS, R/W (See Note) 60 59
BS
Freescale Semiconductor, Inc...
64 RD 55 53 68 WR 56 58 D0-D15 Data Out 57 63 54 52
62
67
66 65
69
61 Data In
NOTE: During Read-Modify-Write instructions and internal instructions, the address lines do not change state.
Figure 19 External Bus Asynchronous Timing
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
33
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Bus Arbitration Timing -- Slave Mode
Bus Arbitration Timing -- Slave Mode
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load)
cyc WS WT WX WP = Clock cycle = 1/2 instruction cycle = 2 T cycles = Number of Wait States for external X or P memory, Determined by BCR Register (WS = 0 to 31) = WS x cyc=2T x WS = Number of Wait States for external X memory, Determined by BCR Register (WS = 0 to 31) = Number of Wait States for external P memory, Determined by BCR Register (WS = 0 to 31)
Freescale Semiconductor, Inc...
Table 17 Slave Mode
40/50/60 MHz Num
70 71
Characteristics Min
BR Input to CLKO low setup time Delay from BR Input Assertion to BG Output Assertion (See Note 1) (See Note 2) (See Note 3) (See Note 4) (See Note 5) 0 5T+1.9 3T+1.9 5T+1.9 NA T+1.9 1.9 (See Note 1) (See Note 5) (See Note 6) 5T-0.5 2T-0.5 3T-0.5 2.7 3.2 3.3 (See Note 1) (See Note 5) (See Note 7) (See Note 1) (See Note 5) (See Note 7) 4T+2.5 3T+3.2 3T+3.2 2.5 3.2 3.2 1.3 2.3 1 2
Unit Max
1 9T+4.2 6T+WT+4.2 26T+4T x WX +2T x WP+4.2 NA 3T+4.2 5.2 -- -- -- 6.5 7.8 8.1 9T+6.4 8T+7.8 8T+8.0 6.4 7.8 8.0 3.6 5 3 4.4 ns ns
72 73
CLKO high to BG Output Assertion BG Output Deassertion Duration
ns ns
74 75 76 77
CLKO High to Control Bus High Impedance CLKO High to BB Output Deassertion CLKO High to BB Input BR Input Deassertion to BG Output Deassertion CLKO Low to BG Deassertion CLKO High to BG Deassertion CLKO High to BG Deassertion CLKO High to BB Output Active CLKO High to BB Output Assertion CLKO High to Address and Control Bus Active CLKO High to Address and Control Bus Valid
ns ns ns ns
78
ns
79 80 81 82 NOTES:
ns ns ns ns
1. With no external access from the DSP56156 2. During external read or write access 3. During external read-modify-write access 4. During Stop mode -- external bus is released and BG is always low 5. During Wait mode 6. With external accesses pending by the DSP56156 7. Slave mode, when bus is still busy after bus request has been deasserted
34
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Bus Arbitration Timing -- Slave Mode
CLKO (Output)
70 BR (Input) 71
Freescale Semiconductor, Inc...
72 BG (Output) 73
75 BB (I/O) 76
A0-A15 PS/DS R/W 74
D0-D15
74
Figure 20 Bus Arbitration Timing -- Slave Mode -- Bus Release
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
35
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Bus Arbitration Timing -- Slave Mode
CLKO (Output)
70 BR (Input)
77
Freescale Semiconductor, Inc...
78 BG (Output)
79 BB (I/O) 80 82 A0-A15 PS/DS R/W 81
Figure 21 Bus Arbitration Timing -- Slave Mode -- Bus Acquisition
36
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Bus Arbitration Timing -- Master Mode
Bus Arbitration Timing -- Master Mode
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) Table 18 Master Mode
40 MHz Num
85
50 MHz Min
4.7 6.5 0 6.5 0 4.7
60 MHz Unit Min
4.7 4.5 0 4.5 0 4.7
Characteristic Min
CLKO High to BR Output Assertion CLKO High to BR Output Deassertion BG Input Asserted/ Deasserted to CLKO Low (Setup) CLKO Low to BG Input Invalid (Hold) BB Input Deasserted to CLKO Low (Setup) CLKO Low to BB Input Deasserted (Hold) CLKO High to BB Output Asserted 4.7 9.2 0 9.2 0 4.7
Max
12 -- -- -- -- 12
Max
12 -- -- -- -- 12
Max
12 -- -- -- -- 12 ns ns ns ns ns ns
Freescale Semiconductor, Inc...
86 87 88 89 90
CLKO (Output) 85 BR (Output)
87 BG (Input) 86 88 BB (I/O) 89 90 82 A0-A15 PS/DS R/W 81
Three-state
Figure 22 Bus Arbitration Timing -- Master Mode -- Bus Acquisition
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
37
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Bus Arbitration Timing -- Master Mode
CLKO (Output)
85
Freescale Semiconductor, Inc...
BR (Output) 86 87 BG (Input) 75
BB (I/O)
76
A0-A15 PS/DS R/W 74
Figure 23 Bus Arbitration Timing -- Master Mode -- Bus Release
38
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Host Port Timing
Host Port Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load)
T = ICYC / 4 cyc = Clock cycle = 1/2 instruction cycle= 2 T cycle tHSDL = Host Synchronization Delay Time (See Note 1) tsuh = Host Processor Data Setup Time
Freescale Semiconductor, Inc...
Active low lines should be "pulled up" in a manner consistent with the AC and DC specifications.
Table 19 Host Port Timing
40 MHz Num Characteristic Min 100 101 tHSDL Host Synchronous Delay (See Note 1) HEN/HACK Assertion Width * CVR, ICR, ISR Read * Read * Write (See Notes 2, 4) HEN/HACK Deassertion Width (See Note 2) Minimum Cycle Time Between Two HEN Assertion for Consecutive CVR, ICR, ISR Reads Host Data Input Setup Time before HEN/HACK Deassertion Host Data Input Hold Time after HEN/HACK Deassertion HEN/HACK Assertion to Output Data Active from High Impedance HEN/HACK Assertion to Output Data Valid HEN/HACK Deassertion to Output Data High Impedance Output Data Hold Time after HEN/HACK Deassertion T Max 3T Min T Max 3T Min T Max 3T ns 50 MHz 60 MHz Unit
2T+36 32+tsuh 32
-- --
2T+33 29+tsuh 29
-- --
2T+30 26+tsuh 26
ns -- --
102 103
31 4T+36
-- --
29 4T+33
-- --
27 4T+30
-- --
ns ns
104 105 106 107 108 109
5 7 0 -- -- 5
-- -- -- 32 20 --
4 6 0 -- -- 5
-- -- -- 29 18.5 --
3 5 0 -- -- 4
-- -- -- 26 17 --
ns ns ns ns ns ns
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
39
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Host Port Timing
Table 19 Host Port Timing (continued)
40 MHz Num
110 111
50 MHz Min
5 5 5 4 7.5 7 5
60 MHz Unit Min
4 4 4 3 6 6 4
Characteristic Min
HR/W Low Setup Time before HEN Assertion HR/W Low Hold Time after HEN Deassertion HR/W High Setup Time to HEN Assertion HR/W High Hold Time after HEN/HACK Deassertion HA0-HA2 Setup Time before HEN Assertion HA0-HA2 Hold Time after HEN Deassertion DMA HACK Assertion to HREQ Deassertion (See Note 3) DMA HACK Deassertion to HREQ Assertion (See Note 3) for DMA RXL Read 6 6 6 5 9 8 5
Max
-- -- -- -- -- -- 2T +37
Max
-- -- -- -- -- -- 2T +36
Max
-- -- -- -- -- -- 2T +35 ns ns ns ns ns ns ns
Freescale Semiconductor, Inc...
112 113 114 115 116 117
tHSDL +3T+5 tHSDL +2T+5 5 tHSDL +3T+5 tHSDL +2T+5 5
--
tHSDL 3T+5 tHSDL +2T+5 5
--
tHSDL +3T+4 tHSDL +2T+4 4
--
ns ns
for DMA TXL Write
-- --
-- --
-- --
ns
for All Other Cases 118 119 120 Delay from HEN Deassertion to HREQ Assertion for RXL Read (See Note 3) Delay from HEN Deassertion to HREQ Assertion for TXL Write (See Note 3) Delay from HEN Assertion to HREQ Deassertion for RXL Read, TXL Write (See Note 3)
-- -- 2T +37
tHSDL +3T+5 tHSDL +2T+5 5
-- -- 2T +36
tHSDL +3T+4 tHSDL +2T+4 5
-- -- 2T +35
ns ns ns
NOTES:
1. "Host Synchronization Delay (tHSDL)" is the time period required for the DSP56156 to sample any external asynchronous input signal, determine whether it is high or low, and synchronize it to the internal clock. 2. See Host Port Considerations. 3. HREQ is pulled up by 1 k. 4. Only if two consecutive reads from one of these registers are executed.
40
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Host Port Timing
External 100 Internal 100
Freescale Semiconductor, Inc...
Figure 24 Host Synchronization Delay
HREQ (Output) 103 101 102
HACK (Input) 112 HR/W (Input) 113
107 106 H0-H7 (Output) Data 109 Valid
108
Figure 25 Host Interrupt Vector Register (IVR) Read
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
41
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Host Port Timing
HREQ (Output) 103 HEN (Input) RXH Read 101 114
120 118
RXL Read 102 115 Address Valid 113
Freescale Semiconductor, Inc...
HA0-HA2 (Input)
Address Valid 112
HR/W (Input) 107 106 H0-H7 (Output) Data Valid 108 109 Data Valid
Figure 26 Host Read Cycle (Non-DMA Mode)
HREQ (Output) 103 HEN (Input) TXH Write 101 114 HA0-HA2 (Input) Address Valid 110 HR/W (Input) 104 H0-H7 (Input)
120
119
TXL Write 102 115 Address Valid 111
105 Data Valid Data Valid
Figure 27 Host Write Cycle (Non-DMA Mode)
42 DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Host Port Timing
HREQ (Output) 116 101 RXH Read 107 106 H0-H7 (Output) Data Valid 102 RXL Read 108 109 Data Valid 117
HACK (Input)
Freescale Semiconductor, Inc...
Figure 28 Host Read Cycle (DMA Mode)
HREQ (Output) 116 101 HACK (Input) 104 105 H0-H7 (Input) Data Valid Data Valid TXH Write 102 TXL Write 117
Figure 29 Host Write Cycle (DMA Mode)
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
43
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing SSI Timing
Synchronous Serial Interfaces (SSI) Timing
(VCC = 5.0 V dc 10%, TJ = -40 to + 125C, CL = 50 pF + 1 TTL Load) T SCK FST (Transmit Frame Sync) FSR (Receive Frame Sync) i ck x ck i ck a ICYC / 4 Serial Clock Pin SCx0 Pin SCx1 Pin Internal Clock External Clock Internal Clock, Asynchronous Mode (Asynchronous implies that FSR and FST are two different frame syncs) i ck s = Internal Clock, Synchronous Mode (Synchronous implies that only one frame sync FS is used) bl = bit length wl = word length = = = = = = =
Freescale Semiconductor, Inc...
Table 20 Synchronous Serial Interfaces Timing
40/50/60 MHz Num
130 131 132 133 134 135 136 137 138 139
Characteristic Min
Clock Cycle (See Note) Clock High Period Clock Low Period Output Clock Rise/Fall Time SCK Rising Edge to FSR Out (bl) High SCK Rising Edge to FSR Out (bl) Low SCK Rising Edge to FSR Out (wl) High SCK Rising Edge to FSR Out (wl) Low Data In Setup Time before SCK Falling Edge Data In Hold Time after SCK Falling Edge 100 45 45 -- -- -- -- -- -- -- -- -- 30 40 25 12
Case Max
-- -- -- 7 32 18 32 15 32 15 32 15 -- -- -- -- -- -- -- -- x ck i ck a x ck i ck a x ck i ck a x ck i ck a x ck i ck x ck i ck
Unit
ns ns ns ns ns ns ns ns ns ns
NOTE: All the timings for the SSI are given for a non-inverted serial clock polarity (SCKP=0 in CRB) and a noninverted frame sync (FSI=0 in CRB). If the polarity of the clock and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal SCK and/or the frame sync FSR/FST in the tables and in the figures.
44
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing SSI Timing
Freescale Semiconductor, Inc...
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
45
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing SSI Timing
Table 20 Synchronous Serial Interfaces Timing (continued)
40/50/60MHz Num
140 141 142
Characteristic Min
FSR Input (bl) High before SCK Falling Edge FSR Input (wl) High before SCK Falling Edge FSR Input Hold Time after SCK Falling Edge Flags Input Setup before SCK Falling Edge Flags Input Hold Time after SCK Falling Edge SCK Rising Edge to FST Out (bl) High SCK Rising Edge to FST Out (bl) Low SCK Rising Edge to FST Out (wl) High SCK Rising Edge to FST Out (wl) Low SCK Rising Edge to Data Out Enable from High Impedance SCK Rising Edge to Data Out Valid SCK Rising Edge to Data Out High Impedance FST Input (bl) Setup Time before SCK Falling Edge FST Input (wl) to Data Out Enable from High Impedance FST Input (wl) Setup Time before SCK Falling Edge FST Input Hold Time after SCK Falling Edge Flag Output Valid after SCK Rising Edge 7 15 7 15 15 7 7 15 15 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 6 16 -- 8 17 15 4 -- --
Case Max
-- -- -- -- -- -- -- -- -- -- 33 15 30 15 30 15 33 15 30 12 30 12 30 20 -- -- 36 -- -- -- -- 32 15 x ck i ck a x ck i ck a x ck i ck a x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck -- x ck i ck x ck i ck x ck i ck
Unit
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Freescale Semiconductor, Inc...
143 144 145 146 147 148 149 150 151 152 153 154 155 156
46
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing SSI Timing
130
133
131
132
Freescale Semiconductor, Inc...
SCK (Input/Output) 134 FSR (Bit) Out 136 FSR (Word) Out 138 Data In 140 FSR (Bit) In 142 First Bit 139 Last Bit 137 135
141 FSR (Word) In 143 Flags In
142
144
Figure 30 SSI Receiver Timing
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
47
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing Timer Timing
130
133 SCK (Input/Output)
131
132
145
146
Freescale Semiconductor, Inc...
FST (Bit) Out
147 FST (Word) Out 150 149 Data Out 152 155 FST (Bit) In 153 154 FST (Word) In 156 Flags Out 155 First Bit Last Bit 150
148
151
(See Note)
Figure 31 SSI Transmitter Timing
NOTE: In the Network mode, output flag transitions can occur at the start of each time slot within the frame. In the Normal mode, the output flag state is asserted for the entire frame period.
48
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing OnCE Port Timing
Timer Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) Table 21 Timer Timing
40/50/60 MHz Num Characteristic Min Max
-- -- 14 20.7 -- -- ns ns ns ns ns ns TIN Valid to CLKO Low (Setup time) CLKO Low to TIN Invalid (Hold time) CLKO High to TOUT Asserted CLKO High to TOUT Deasserted TIN Period TIN High/Low Period 6 0 3.5 5.1 8T 4T
Unit
Freescale Semiconductor, Inc...
170 171 172 173 174 175
CLKO (Output)
170 TIN (Input) 172 TOUT (Output) 171 173
Figure 32 Timer Timing
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
49
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing OnCE Port Timing
OnCETM Port Timing
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load)
Table 22 OnCE Port Timing
40/50/60 MHz Num Characteristic Min
180 181 182 183 184 185 186 187 188 DSCK High to DSO Valid DSI Valid to DSCK Low (Setup) DSCK Low to DSI Invalid (Hold) DSCK High DSCK Low DSCK Cycle Time CLKO High to OS0-OS1 Valid CLKO High to OS0-OS1 Invalid Last DSCK High to OS0-OS1 Last DSCK High to ACK Active (data) Last DSCK High to ACK Active (command) DSO (ACK) Asserted to OS0-OS1 Three-state DSO (ACK) Asserted to First DSCK High DSO (ACK) Width Asserted: * when entering debug mode * when acknowledging command/data transfer Last DSCK High of Read Register to First DSCK High of Next Command DSCK High to DSO Invalid DR asserted to DSO (ACK) Asserted (See Note 2) (See Note 2) (See Note 2) (See Note 2) -- 10T+Td+14.5 10T+Td+13.5 21T+Td+13.5 -- 3Tc 3T-2 2Tc+0.5 6Tc Td+11.2 11T+19.5 (See Note 1) (See Note 1) (See Note 1) -- 5.2 0 2Tc 2Tc 4Tc
Unit Max
37 -- -- -- -- -- 14.5 -- -- -- 0 -- 3T-5 2Tc+3 -- -- -- ns ns ns ns ns ns ns ns ns
Freescale Semiconductor, Inc...
189 190 191
ns ns ns ns ns ns ns
192 193 194
NOTES:
1. 45%-55% duty cycle 2. Td = DSCK High (Timing #183)
50
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
AC Electrical Characteristics and Timing OnCE Port Timing
183 DSCK (Input) 184 185
Freescale Semiconductor, Inc...
Figure 33 OnCE Port Serial Clock Timing
DR (Input)
194 DSO (Output)
ACK
Figure 34 OnCE Port Acknowledge Timing
DSCK (Input) 180 DSO (Output)
(Last) (See Note) 193
(OS1)
(ACK)
DSI (Input) 181 182 NOTE: Three-state, external pull-down resistor 188
(OS0)
Figure 35 OnCE Port Data I/O To Status Timing
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
51
Freescale Semiconductor, Inc.
Pin-out and Package Top View
Pin-out and Package Information
D1 D0 A15 A14 GND3 A13 A12 A11 GNDQ1 VCC2 A10 GND2 A9 A8 A7 A6 VCCQ1 GND1 A5 A4 VCC1 A3 A2 GND0 A1 A0 MODC MODB/IRQB
Freescale Semiconductor, Inc...
GND4 D2 D3 VCC3 D4 D5 GND5 D6 D7 D8 D9 GND6 D10 D11 VCC4 D12 D13 GND7 D14 D15 TA DR VCCA SPKP SPKM GNDA VDIV VREF
85
1
Orientation Mark
(Top View)
57 29
MODA/IRQA RESET STD0/PC0 SRD0/PC1 SCK0/PC2 SC10/PC3 SC00/PC4 TIN/PC10 VCC7 TOUT/PC11 HA0/PB8 GND10 HA1/PB9 HA2/PB10 HR/W/PB11 HEN/PB12 HACK/PB14 HREQ/PB13 H0/PB0 H1/PB1 STD1/PC5 SRD1/PC6 H4/PB4 H3/PB3 H2/PB2 VCC6 H5/PB5 H6/PB6
NOTE: An OVERBAR indicates the signal is asserted when the voltage = ground (active low).
Figure 39 Top View of the DSP56156 112-pin Plastic (FC) and Ceramic (FE) Quad Flat Packages
52
MIC AUX BIAS BG VCCQ0 BR BB VCC5 WR GND8 RD PS/DS BS R/W DSO DSCK/OS1 DSI/OS0 CLKO GNDQ0 GNDS SXFC VCCS EXTAL SC01/PC9 GND9 SC11/PC8 SCK1/PC7 H7/PB7 DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Pin-out and Package Bottom View
Freescale Semiconductor, Inc...
MODA/IRQA RESET STD0/PC0 SRD0/PC1 SCK0/PC2 SC10/PC3 SC00/PC4 TIN/PC10 VCC7 TOUT/PC11 HA0/PB8 GND10 HA1/PB9 HA2/PB10 HR/W/PB11 HEN/PB12 HACK/PB14 HREQ/PB13 H0/PB0 H1/PB1 STD1/PC5 SRD1/PC6 H4/PB4 H3/PB3 H2/PB2 VCC6 H5/PB5 H6/PB6
85
MODB/IRQB MODC A0 A1 GND0 A2 A3 VCC1 A4 A5 GND1 VCCQ1 A6 A7 A8 A9 GND2 A10 VCC2 GNDQ1 A11 A12 A13 GND3 A14 A15 D0 D1
1
Orientation Mark (on Top side)
(Bottom View)
57 29
GND4 D2 D3 VCC3 D4 D5 GND5 D6 D7 D8 D9 GND6 D10 D11 VCC4 D12 D13 GND7 D14 D15 TA DR VCCA SPKP SPKM GNDA VDIV VREF
NOTE: An OVERBAR indicates the signal is asserted when the voltage = ground (active low).
Figure 40 Bottom View of the DSP56156 112-pin Plastic (FC) and Ceramic (FE) Quad Flat Packages
H7/PB7 SCK1/PC7 SC11/PC8 GND9 SC01/PC9 EXTAL VCCS SXFC GNDS GNDQ0 CLKO DSI/OS0 DSCK/OS1 DSO R/W BS PS/DS RD GND8 WR VCC5 BB BR VCCQ0 BG BIAS AUX MIC DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
53
Freescale Semiconductor, Inc.
Pin-out and Package General Purpose I/O
Table 23 DSP56156 General Purpose I/O Pin Identification
112-pin Package Pin # 66 DSP56156 Primary Pin Function H0 H1 H2 H3 H4 H5 H6 H7 HA0 HA1 HA2 HR/W HEN HREQ HACK STD0 SRD0 SCK0 SC10 SC00 STD1 SRD1 SCK1 SC11 SC01 TIN TOUT DSP56156 General Purpose I/O ID PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PB8 PB9 PB10 PB11 PB12 PB13 PB14 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PC8 PC9 PC10 PC11
Freescale Semiconductor, Inc...
65 60 61 62 58 57 56 74 72 71 70 69 67 68 82 81 80 79 78 64 63 55 54 52 77 75
NOTES:
1. In Tables 23, 24, and 25, OVERBAR indicates the signal is asserted when the voltage = ground (active low). 2. For more information on power and ground, see Table 26 under Design Considerations.
54
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Pin-out and Package Pin Number
Freescale Semiconductor, Inc...
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
55
Freescale Semiconductor, Inc.
Pin-out and Package Signal Name
Table 24 DSP56156 Pin Identification by Pin Number
112-pin Package Pin # 1 2 3 4 5 Signal Name GND4 D2 D3 VCC3 D4 D5 GND5 D6 D7 D8 D9 GND6 D10 D11 VCC4 D12 D13 GND7 D14 D15 TA DR VCCA SPKP SPKM GNDA VDIV VREF MIC AUX BIAS BG VCCQ0 BR BB VCC5 WR GND8 DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
112-pin Package Pin # 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75
Signal Name RD PS/DS BS R/W DSO DSCK/OS1 DSI/OS0 CLKO GNDQ0 GNDS SXFC VCCS EXTAL SC01/PC9 GND9 SC11/PC8 SCK1/PC7 H7/PB7 H6/PB6 H5/PB5 VCC6 H2/PB2 H3/PB3 H4/PB4 SRD1/PC6 STD1/PC5 H1/PB1 H0/PB0 HREQ/PB13 HACK/PB14 HEN/PB12 HR/W/PB11 HA2/PB10 HA1/PB9 GND10 HA0/PB8 TOUT/PC11
112-pin Package Pin # 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112
Signal Name VCC7 TIN/PC10 SC00/PC4 SC10/PC3 SCK0/PC2 SRD0/PC1 STD0/PC0 RESET MODA/IRQA MODB/IRQB MODC A0 A1 GND0 A2 A3 VCC1 A4 A5 GND1 VCCQ1 A6 A7 A8 A9 GND2 A10 VCC2 GNDQ1 A11 A12 A13 GND3 A14 A15 D0 D1
Freescale Semiconductor, Inc...
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 56
Freescale Semiconductor, Inc.
Pin-out and Package Signal Name
Freescale Semiconductor, Inc...
MOTOROLA
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
57
Freescale Semiconductor, Inc.
Pin-out and Package
Table 25 DSP56156 Pin Identification by Signal Name
112-pin Package Pin # 87 88 90 112-pin Package Pin # 6 8 9 10 11 13 14 16 17 19 20 22 44 45 43 51 89 95 101 108 1 7 12 18 38 53 73 26 112-pin Package Pin # 47 104 48 66 65 60 61 62 58 57 56 74 72 71 68 69 70 67 84 85 29 84 85 86 45 44 66 65
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 AUX BB BG BIAS BR BS CLKO D0 D1 D2 D3 D4
Signal Name D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 DR DSCK DSI DSO EXTAL GND0 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GNDA
Signal Name GNDQ0 GNDQ1 GNDS H0 H1 H2 H3 H4 H5 H6 H7 HA0 HA1 HA2 HACK HEN HR/W HREQ IRQA IRQB MIC MODA MODB MODC OS0 OS1 PB0 PB1
Freescale Semiconductor, Inc...
91 93 94 97 98 99 100 102 105 106 107 109 110 30 35 32 31 34 41 46 111 112 2 3 5
58
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Freescale Semiconductor, Inc.
Pin-out and Package
Freescale Semiconductor, Inc...
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59
Freescale Semiconductor, Inc.
Pin-out and Package
Table 25 DSP56156 Pin Identification by Signal Name (continued)
112-pin Package Pin # 60 61 112-pin Package Pin # 55 54 52 77 75 40 42 39 83 78 52 79 54 80 55 25 24 81 63 82 112-pin Package Pin # 64 49 21 77 75 92 103 4 15 36 59 76 23 33 96 50 27 28 37
Signal Name PB2 PB3 PB4 PB5 PB6 PB7 PB8 PB9 PB10 PB11 PB12 PB13 PB14 PC0 PC1 PC2 PC3 PC4 PC5 PC6
Signal Name PC7 PC8 PC9 PC10 PC11 PS/DS R/W RD RESET SC00 SC01 SC10 SC11 SCK0 SCK1 SPKM SPKP SRD0 SRD1 STD0
Signal Name STD1 SXFC TA TIN TOUT VCC1 VCC2 VCC3 VCC4 VCC5 VCC6 VCC7 VCCA VCCQ0 VCCQ1 VCCS VDIV VREF WR
Freescale Semiconductor, Inc...
62 58 57 56 74 72 71 70 69 67 68 82 81 80 79 78 64 63
60
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Freescale Semiconductor, Inc.
Pin-out and Package 112 CQFP
Freescale Semiconductor, Inc...
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DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
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Freescale Semiconductor, Inc.
Pin-out and Package
S 0.20 (0.008) M T L-M S N S A 0.20 (0.008) M T L-M S N S PIN 1 Identifier 1 VIEW Y 112 85
TOP VIEW
J1 J1
S S
84
N
N
P -L-, -M-, -NVIEW Y
3 Place
T L-M
S
-L-
Freescale Semiconductor, Inc...
-MB
M
0.20 (0.008)
0.20 (0.008)
M
V
T L-M
S
F
PLATING
28 29 -N56
57 J B1
D C E
BASE METAL
VIEW P
DATUM -H- PLANE
0.127 (0.005)
M
T L-M
S
N
S
SECTION J1-J1
112 Place VIEW ROTATED 90
W
G 108 Place
0.15 (0.006) -T- SEATING
PLANE
A1 1 R R1
DATUM -HPLANE DIM A B C D E F G
Case 915-01
MILLIMETERS MIN MAX 18.880 20.400 18.880 20.400 2.740 3.450 0.220 0.380 2.340 3.060 0.220 0.330 0.650 BSC 0.130 0.230 0.650 0.950 0.325 BSC 22.950 23.450 22.950 0.300 23.450 INCHES MIN MAX 0.743 0.803 0.743 0.803 0.108 0.135 0.009 0.015 0.092 0.120 0.009 0.013 0.0256 BSC 0.005 0.009 0.026 0.037 0.0128 BSC 0.904 0.923 0.904 0.012 0.008 0.0047 0.923
R R2 2
K C1
J
K
P
VIEW P NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M, 1982. 2. Controlling dimension: millimeter. 3. Datum plane -H- is coincident with the bottom of the lead where the lead exits the ceramic body. 4. Datums -L-, -M- and -N- to be determined at datum plane -H-. 5. Dimensions S and V to be determined at seating plane -T-. 6. Dimensions A and B define maximum ceramic body dimensions including glass protrusion and mismatch.
S V W A1 B1 C1 R1 R2 1 2
0.200 0.600 0.120 0.132 1.800 REF 0.200 REF 0.200 REF 8 0 8 0
0.024 0.0052 0.070 REF 0.008 REF 0.008 REF 8 0 8 0
NOTE: BSC = Between Statistical Center (i.e., typical)
Figure 41 DSP56156 112-pin Ceramic Quad Flat Pack (CQFP) Mechanical Information
62 DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Pin-out and Package 112 TQFP
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Freescale Semiconductor, Inc.
Pin-out and Package
4x PIN 1 Identifier
1
0.200 (0.008) H L-M N
112
4x 28 TIPS 85 84
0.200 (0.008) T L-M N
J1
4x P
J1
-L-, -M-, -N-
VIEW Y
108x G
-L-
-MB V J
VIEW Y
AA
Freescale Semiconductor, Inc...
B1 V1
28 29 56 57
F D 0.13 (0.005)
M
BASE METAL
T L -M
M
C
M
-NA1 S1 A S C2 C -H3 0.050 (0.002)
S
TOP VIEW
SECTION J1-J1
(VIEW ROTATED 90 COUNTER CLOCKWISE)
VIEW AB 2 0.100 (0.004) -T- SEATING PLANE
DIM A A1 B B1 C C1
Case 987-01
MILLIMETERS MIN MAX 20.000 BSC 10.000 BSC 20.000 BSC 10.000 BSC 1.400 0.050 1.350 0.270 0.450 1.600 0.150 1.450 0.370 0.750 INCHES MIN MAX 0.790 BSC 0.395 BSC 0.790 BSC 0.395 BSC 0.055 0.002 0.053 0.011 0.018 0.063 0.006 0.057 0.014 0.030
R2 0.25 (0.010) R1
GAGE PLANE
C2 D E F G J K
0.270 0.330 0.650 BSC 0.115 0.175 0.500 BSC 0.325 BSC 0.100 0.200 0.100 0.200 22.000 BSC 11.000 BSC 22.000 BSC 11.000 BSC 0.250 REF 1.000 REF 0.115 0.135 0 3 11 11 8 7 13 13
0.011 0.013 0.0256 BSC 0.006 0.007 0.020 BSC 0.013 BSC 0.004 0.008 0.004 0.008 0.866 BSC 0.433 BSC 0.866 BSC 0.433 BSC 0.010 REF 0.039 REF 0.004 0.005 0 3 11 11 8 7 13 13
C1
K E Y Z VIEW AB 1
P R1 R2 S S1 V V1 Y Z AA 1 2 3
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M, 1982. 2. Controlling dimension: Millimeter. 3. Datum plane -H- is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. Datums -L-, -M- and -N- to be determined at datum plane -H-. 5. Dimensions S and V to be determined at seating plane -T-. 6. Dimensions A and B do not include mold protrusion. Allowable protrusion is 0.25 (0.010) per side. Dimensions A and B do include mold mismatch and are determined at datum plane -H-. 7. Dimension D does not include dambar protrusion. Allowable dambar protrusion shall not cause the D dimension to exceed 0.43 (0.017).
NOTE: BSC = Between Statistical Center (i.e., typical)
Figure 42 DSP56156 112-pin Plastic Thin Quad Flat Pack (TQFP) Mechanical Information
64 DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations Heat Dissipation Power, Ground, and Noise
Design Considerations
Heat Dissipation
The average chip junction temperature, TJ, in C, can be obtained from: TJ = TA + (PD x JA) (1) JC is device-related and cannot be influenced by the user. However, CA is user-dependent and can be minimized by such thermal management techniques as heat sinks, ambient air cooling, and thermal convection. Thus, good thermal management on the part of the user can significantly reduce CA so that JA approximately equals JC. Substitution of JC for JA in equation (1) will result in a lower semiconductor junction temperature. Values for thermal resistance presented in this document, unless estimated, were derived using the procedure described in Motorola Reliability Report 7843, "Thermal Resistance Measurement Method for MC68XX Microcomponent Devices", and are provided for design purposes only. Thermal measurements are complex and dependent on procedure and setup. User-derived values for thermal resistance may differ.
Freescale Semiconductor, Inc...
Where: TA = ambient temperature, C JA = package thermal resistance, junction-to-ambient, C/W PD = PINT + PI/O PINT = ICC x VCC watts -- chip internal power PI/O = power dissipation on input and output pins -- user determined For most applications PI/O < PINT and PI/O can be neglected. An appropriate relationship between PD and TJ (if PI/O is neglected) is: PD = K/(TJ + 273) (2)
Solving equations (1) and (2) for K gives: K = PD x (TA + 273) + PD x JA (3)
Power, Ground, and Noise
Each DSP56156 VCC pin should be provided with a low-impedance path to +5 volts. Each DSP56156 GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups of logic on chip as shown in Table 26. The VCC power supply should be bypassed to GND ground using at least six 0.01 - 0.1 F bypass capacitors located either underneath the chip's socket or as close as possible to the four sides of the package. The capacitor leads and the associated printed circuit traces connecting to chip VCC and GND should be kept to less than 0.5" per
Where K is a constant pertaining to the particular package. K can be determined from equation (2) by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA. The total thermal resistance of a package (JA) can be separated into two components, JC and CA, representing the barrier to heat flow from the semiconductor junction to the package (case) surface (JC) and from the case to the outside ambient (CA). These terms are related by the equation: JA = JC + CA (4)
60
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Freescale Semiconductor, Inc.
Design Considerations Power, Ground, and Noise
Freescale Semiconductor, Inc...
capacitor lead. The use of at least a four layer board is recommended, employing two inner layers as VCC and GND planes. All output pins on this DSP have fast rise and fall times. Printed Circuit Board (PCB) trace length should be minimized in order to minimize undershoot and reflections caused by these fast output switching times. This recommendation particularly applies to the address and data buses as well as the PS/DS, BS, RD, WR, R/W, interrupt, and HEN pins. Maximum PCB trace lengths on the order of 6" are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to PCB traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the VCC and GND circuits. Clock signals should not be run across many signals and should be kept away from analog power and ground traces as well as any analog signals. See Figure 44 for more details.
Table 26 Power and Ground Connections
Power Circuitry Signal Name
VCC1 VCC2
Ground Pin # 92 103 Signal Name
GND0 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GNDA GND9 GND10 GNDQ0 GNDQ1 GNDS
Pin # 89 95 101 108 1 7 12 18 38 26 53 73 47 104 48
Address Bus Buffers
Data Bus Buffers
VCC3 VCC4
4 15
Bus Control Buffers Codec Digital Peripherals Internal logic Phase-Locked Loop (PLL)
VCC5 VCCA VCC6 VCC7 VCCQ0 VCCQ1 VCCS
36 23 59 76 33 96 50
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Freescale Semiconductor, Inc.
Design Considerations Power Consumption
Power Consumption
(VCC = 5.0 V dc 10%, TJ = -40 to +125C, CL = 50 pF + 1 TTL Load) The DC electrical characteristics of this device are shown in Table 27. Power consumption is application dependant. The data in Table 27 is collected by running the following code using internal memory after having programmed all pins of port B and C as input and after having three-stated the data bus (MC = 0 in OMR) and pulled high:
move move move move clr move move rep mac move move jmp #0,r0 #0,r3 #$100,r2 #$00ff,m0 a x:(r0)+,a a1,a0 #30 x0,y0,a a,p:(r2) #0,r3 loop
Freescale Semiconductor, Inc...
loop
;initial value to accumulator
x:(r3)+,x0
;mac on typical data ;store the mac result
Table 27 DC Electrical Characteristics
Typical Conditions Symbol 40 MHz 91 12 92 -- -- -- -- -- 50 MHz 112 14 113 250 1 3.6 12 70 60 MHz 133 17 134 -- -- -- -- -- Unit
Digital current with Codec and PLL disabled Digital current Wait Mode with Codec and PLL disabled Digital current Wait Mode with Codec Enabled and PLL disabled Stop mode with PLL and CLKO disabled Digital current drawn by the PLL when active Digital current drawn by CLKO when active Analog current with Codec enabled Analog current with Codec disabled
ICC ICC ICC ICC ICC ICC ICCA ICCA
mA mA mA A mA mA mA A
To minimize the power dissipation, all unused digital input pins should be tied inactive to ground or power; and all unused I/O pins should be tied inactive through a 10K3/4 resistor to ground or power. When the codec is not used, GNDA should be connected to GND; and VCCA should be connected to VCC. Also, all codec pins should be left floating, except VREF which should still be decoupled.
62 DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations Host Port Considerations
Host Port Considerations
Careful synchronization is required when reading multi-bit registers that are written by another asynchronous system. This is a common problem when two asynchronous systems are connected. The situation exists in the host interface. The considerations for proper operation are discussed below.
Freescale Semiconductor, Inc...
Host Programming Considerations
1. Unsynchronized Reading of Receive Byte Registers
When reading receive byte registers, RXH or RXL, the host program should use interrupts or poll the RXDF flag which indicates that data is available. This assures that the data in the receive byte registers will be stable.
by the DSP, but the possibility exists that the state of the bit could be changing during the read operation. This is generally not a system problem, since the bit will be read correctly in the next pass of any host polling routine. However, if the host asserts HEN for more than timing number 101 (T101), with a minimum cycle time of timing number 103 (T103), then these status bits are guaranteed to be stable. Care must be exercised when reading status bits HF3 and HF2 as an encoded pair. If the DSP changes HF3 and HF2 from 00 to 11, there is a small probability that the host could read the bits during the transition and receive 01 or 10 instead of 11. If the combination of HF3 and HF2 has significance, the host could read the wrong combination. Therefore, read the bits twice and check for consensus.
4. Overwriting the Host Vector
The host program should change the Host Vector register only when the Host Command bit (HC) is clear. This change will guarantee that the DSP interrupt control logic will receive a stable vector.
2. Overwriting Transmit Byte Registers
The host program should not write to the transmit byte registers, TXH or TXL, unless the TXDE bit is set indicating that the transmit byte registers are empty. This guarantees that the transmit byte registers will transfer valid data to the HRX register.
5. Cancelling a Pending Host Command Exception
The host processor may elect to clear the HC bit to cancel the host command exception request at any time before it is recognized by the DSP. Because the host does not know exactly when the exception will be recognized (due to exception processing synchronization and pipeline delays), the DSP may execute the host command exception after the HC bit is cleared. For these reasons, the HV bits must not be changed at the same time that the HC bit is cleared.
3. Synchronization of Status Bits from DSP to Host
HC, HREQ, DMA, HF3, HF2, TRDY, TXDE, and RXDF status bits are set or cleared from inside the DSP and read by the host processor (refer to DSP56156 User's Manual, I/O Interface section, Host/ DMA Interface Programming Model for descriptions of these status bits). The host can read these status bits very quickly without regard to the clock rate used
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Design Considerations DSP Programming Considerations Bus Operation
DSP Programming Considerations
1. Synchronization of Status Bits from Host to DSP
DMA, HF1, HF0, and HCP, HTDE, and HRDF status bits are set or cleared by the host processor side of the interface. These bits are individually synchronized to the DSP clock. (Refer to the DSP56156 User's Manual, I/O Interface section, Host/DMA Interface Programming Model for descriptions of these status bits.)
2. Reading HF0 and HF1 as an Encoded Pair
Care must be exercised when reading status bits HF0 and HF1 as an encoded pair, i.e., the four combinations 00, 01, 10, and 11 each have significance. A very small probability exists that the DSP will read the status bits synchronized during transition. Therefore, HF0 and HF1 should be read twice and checked for consensus.
Freescale Semiconductor, Inc...
Bus Operation
Figure 43 depicts the operation of the external memory interface with multiple wait states.
T0 T1
T2 Tw T2
Tw
T2 Tw
T2
T3
T0 T1
T2
Tw
T2
Tw
T2 Tw T2
T3 T0
T1
T
CLKO BS PS/DS A0-A15 R/W WR RD Data in Data out
D0-D15
Figure 43 Read and Write Bus Operation (3 Wait States)
64
DSP56156 Data Sheet For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations Analog I/O Considerations
Analog I/O Considerations
Figure 44 describes the recommended analog I/O and power supply configurations. The two analog inputs are electrically identical. When one is not used, it can be left floating. When used, an AC coupling capacitor is required. The value of the capacitor along with the input impedance of the pin determine the cut off frequency of a high pass filter. The input impedance of the MIC and AUX varies as a function of the sigma-delta (y) modulator master clock. 78 k is a typical value at 2 MHz. An AC capacitor of 1F defines a high pass filter pole of 2 Hz. A smaller capacitor value will move this pole higher in frequency.
Freescale Semiconductor, Inc...
VREF 1 F 600 0.001 F 600 1 F 0.001 F RBias (to microphone) + 15 F 10 K ( 1mA) 0.1 F VDIV 54 K 36 K SPKP 50 nF S1 K SPKM VC3-VC0 digital VCC digital GND 0.01 F 220 F + GND External GND +5 V External Supply GNDA VCCA 15 F + VREF Bias GNDA 5.6 K MIC
MGS1-0 bits INS bit
-6 dB
MUX
VREF 5.6 K AUX
VCCA
6 dB
modulator
17 dB
2.0 V 10% (2/5 VCC)
GNDA S10 F
3 POLE 2 ZERO Low Pass Filter (LPF)
GNDA
+5 dB
Single trace
0.1 F Analog Decoupling near DSP
Single trace
Figure 44 Recommended Analog I/O Configuration
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Freescale Semiconductor, Inc.
Design Considerations Analog I/O Considerations
Figure 45 shows three possible single-ended output configurations. Configuration (a) is highly recommended. For configurations (b) and (c), an AC coupling capacitor is required since the load resistor is tied to GNDA.
VREF VCCA 47 K3/4 SPKP 47 K3/4 S 500 47 K3/4 SPKM NC SPKM 0 < C 100 nF S 500 (a) (b) (c) SPKM S 500 0 < C 100 nF SPKP 0 < C 100 nF SPKP
+
Freescale Semiconductor, Inc...
GNDA 47 K3/4
Figure 45 Single-ended Output Configurations
Figure 46 shows a recommended layout for power and ground planes.
84 85 57 56 29
112
1
28
Digital Ground and Power planes
Analog Ground and Power planes
Figure 46 Ground and Power planes
66
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MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations Analog I/O Considerations
A four level board is recommended. The top layer (directly under the parts) and the bottom layer should be interconnect layers. The two center layers should be power and ground. Ground and power planes should be completely separated. The digital and analog power/ ground planes should not overlap. All codec pins should be over the analog planes. The analog planes should not encompass any digital pins. All codec signal traces should be over the analog planes. Figure 47 shows that 0.1 F bypass caps should be located as close to the pins being bypassed as possible. The ground side of these caps should be connected as close as possible to the VCCA pin. The ground side of the bypass cap should be connected to the VCCA pin by short traces.
Freescale Semiconductor, Inc...
BIAS GNDA SPKM SPKP VREF VCCA VDIV AUX MIC
29 28
10 k
0.1 F 65 F 25 F
0.1 F S10 F
Figure 47 Suggested Top Layer Bypassing
The pins with 0.1 F bypass caps are VREF and GNDA. The largest size practical bypass caps should also be added for each of these pins as well as for the VDIV pin; 10 F bypass caps should be considered a minimum value for the larger caps (65 F on VDIV may be used). These caps should be near the package but do not have to be right next to the pins. The DAC outputs (SPKP and SPKM) should be run right next to each other as shown on Figure 48.
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Freescale Semiconductor, Inc.
Design Considerations Analog I/O Considerations
BIAS
GNDA
SPKM
SPKP
AUX
0.25 F
VCCA
VDIV
VREF
MIC
29 28
MIC IN
1nF
Freescale Semiconductor, Inc...
5.6 k
47 k
47 k 47 k
Copper Fill of unused board space should be connected to the analog ground plane.
47 k
SPK OUT
Figure 48 Suggested Bottom Layer Routing
The output should be used differentially if at all possible. Analog signal traces should be shielded by running traces connected to analog ground next to them. Unused board area on both interconnect levels should be copper filled and connected to analog ground. The copper fill is only shown on this page for clarity and simplicity. The ADC input anti-aliasing should be done with respect to VREF.
Figure 49 presents four options for good power supply connections.
68
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MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations Analog I/O Considerations
10
GNDA SPKP SPKM VCCA
GNDA SPKP SPKM VCCA VDIV VREF
VDIV VREF
10
BIAS AUX MIC
28
BIAS AUX MIC
29
29
28
Freescale Semiconductor, Inc...
Voltage Regulator
Voltage Regulator
Ideal Choice -- Two separate power supplies.
Ground planes connected with a single trace as close as possible to the V CCA pin on the codec.
Second Choice -- One power supply.
Two regulators, one for the digital supply, one for the analog supply. Ground planes connected with a 10 3/4 resistor as close as possible to the VCCA pin on the codec.
10
GNDA SPKP SPKM VCCA VDIV VREF
GNDA SPKP SPKM VCCA VDIV VREF
BIAS AUX MIC
28
BIAS AUX MIC
28
29
29
Voltage Regulator
Third Choice -- One power supply.
One regulator for the analog supply. Digital supplies driven directly by voltage source. Ground planes connected with a 10 3/4 resistor as close as possible to the VCCA pin on the codec.
Fourth Choice -- One power supply. Ground planes connected at source. Ground planes connected with a 10 3/4 resistor as close as possible to the VCCA pin on the codec.
Figure 49 Four Possible Power Supply Connections
MOTOROLA
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Freescale Semiconductor, Inc.
Ordering Information
Ordering Information
Table 28 lists information for ordering parts.
Table 28 DSP56156 Ordering Information
Supply Voltage Package Type
Ceramic Quad Flat Pack (CQFP) Plastic Thin Quad Flat Pack (TQFP)
Pin Count
Frequency (MHz)
40
Order Number
DSP56156FE40 DSP56156FE60 DSP56156FV40 DSP56156FV60
Freescale Semiconductor, Inc...
5V 5V
112
60 40
112
60
70
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MOTOROLA
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and M are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
Literature Distribution Centers: USA: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. EUROPE: Motorola Ltd.; European Literature Center; 88 Tanners Drive, Blakelands, Milton Keynes, MK14 5BP, England. JAPAN: Nippon Motorola Ltd.; 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141 Japan. ASIA-PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbor Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.
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